教育背景：

(1) 2010.9–2013.7, 深圳大学, 光学工程, 工学博士；
(2) 2007.9–2010.7, 深圳大学, 机械电子工程, 工学硕士；
(3) 2003.9–2007.7, 中国人民解放军海军航空大学,工学学士；

工作履历：

(1) 2017.12-至今, 深圳大学, 机电与控制工程学院机械电子工程系, 副教授；
(2) 2017.1-2017.11, 深圳大学, 机电与控制工程学院机械电子工程系, 副研究员；
(3) 2015.7-2016.12, 深圳大学, 机电与控制工程学院机械电子工程系, 讲师；
(4) 2013.7-2015.6, 深圳大学与哈尔滨工业大学联合培养, 博士后；

主持项目：

1、三维微电极叠层拟合制备及其成形磨削与质量控制，国家自然科学基金项目，25万元，已提交结题申请。
2、三维队列微电极叠层拟合制备及其微细电火花加工应用，广东省自然科学基金项目，
10万元，在研。
3、复合材料三维电极微模具关键技术研发，深圳市技术攻关项目，120万元，在研。
4、薄片队列微电极微细电火花加工三维微模具及其表面台阶效应与电极损耗规律，深圳市基础研究项目，50万元，在研。

代表期刊论文 ：

[1] Bin Xu, Xiao-yu Wu, Jian-guo Lei, Feng Luo, Feng Gong, Chen-lin Du, Xiu-quan Sun, Shuang-chen Ruan. Research on micro-electric resistance slip welding of copper electrode during the fabrication of 3D metal micro-mold [J]. Journal of Materials Processing Technology, 2013, 213: 2174-2183.
[2] Bin Xu, Xiao-yu Wu, Jian-guo Lei, Rong Cheng, Shuang-chen Ruan, Zhen-long Wang. Laminated fabrication of 3D micro-electrode based on WEDM and thermal diffusion welding [J]. Journal of Materials Processing Technology, 2015, 221: 56-65.
[3] Bin Xu, Xiao-yu Wu, Jian-guo Lei, Rong Cheng, Shuang-chen Ruan, Zhen-long Wang. Laminated fabrication of 3D queue micro-electrode and its application in micro-EDM [J]. International Journal of Advanced Manufacturing Technology, 2015, 80: 1701-1711.
[4] Bin Xu, Xiao-yu Wu, Jiang Ma, Xiong Liang, Jian-guo Lei, Bo Wu, Shuang-chen Ruan, Zhen-long Wang. Micro-EDM of 3D micro-mold from Pd40Cu30P20Ni10 metallic glass by using laminated 3D micro-electrode. [J]. Journal of Micromechanics and Microengineering, 2016, 26, 035004.
[5] Bin Xu, Xiao-yu Wu, Shi-quan Ling, Feng Luo, Chen-lin Du, Xiu-quan Sun. Fabrication of 3D metal micro-mold based on femtosecond laser cutting and micro-electric resistance slip welding [J]. International Journal of Advanced Manufacturing Technology, 2013, 66: 601-609.
[6] Bin Xu, Xiao-yu Wu, Shi-quan Ling, Feng Luo, Gong Feng, Chen-lin Du, Shuang-chen Ruan, Xiu-quan Sun. Study on tungsten electrode deposition effect of 3D metal micro-mold during laminated slip welding [J]. International Journal of Advanced Manufacturing Technology, 2013, 67: 2529-2536.
[7] Bin Xu, Xiao-yu Wu*, Jian-guo Lei, Feng Luo, Chen-lin Du, Shuang-chen Ruan, Zhen-long Wang. Study on the Joining of 2D Microstructure during the Fabrication of 3D Micro-Mold [J]. International Journal of Precision Engineering and Manufacturing, 2014, 15(4):725-734.
[8] Bin Xu, Xiao-yu Wu, Jian-guo Lei, Feng Luo, Feng Gong, Chen-lin Du, Xiu-quan Sun, Shuang-chen Ruan. Error Analysis of 3D Metal Micro-mold Fabricated by Femtosecond Laser Cutting and Micro Electric Resistance Slip Welding [J]. Advances in Mechanical Engineering, 2013, DOI: 10.1155/2013/464769.
[9] Xu Bin，Wu Xiao-yu，Lei Jian-guo，Liang Xiong，Zhao Hang，Guo Deng-ji，Ruan Shuang-chen，Micro-ECM of 3D micro-electrode for efficiently processing 3Dmicro-structure[J]. International Journal of Advanced Manufacturing Technology，2016：1~9.
[10] Xu Bin, Guo Kang, Wu Xiao-yu, Lei Jian-guo, Liang Xiong, Guo Deng-ji, Ma Jiang, Cheng Rong, Applying a foil queue micro-electrode in micro-EDM to fabricate a 3D micro-structure [J]. Journal of Micromechanics and Microengineering, 2018, 28(5): 1~11.
[11] Xu Bin, Wu Xiao-yu, Lei Jian-guo, Zhao Hang, Liang Xiong, Cheng Rong, Guo Deng-ji, Elimination of 3D micro-electrode’s step effect and applying it in micro-EDM [J]. International Journal of Advanced Manufacturing Technology, 2018(2018): 1~10.
[12] Jianguo Lei, Xiaoyu Wu, Bin Xu, Zhentao Zhao, Shuangchen Ruan, Rong Cheng. Laminated fitting fabrication of Cu–Sn composite 3D microelectrodes and elimination of ridges on the machined surface of 3D micro-cavities [J]. Journal of Materials Processing Technology, 2015, 225: 24-31. (通讯作者)
[13] Wen-yan Luo, Xiao-yu Wu, Shi-yun Wu, Bin Xu, Rong Cheng, Shuang-chen Ruan. Micro-ultrasonic powder moulding of Sn–BiCu composite microparts in semisolid form [J]. Journal of Materials Processing Technology, 2015, 223: 313-318. (通讯作者)
[14] Xiong Liang, Xiaoyu Wu, Bin Xu, Jiang Ma, Zhiyuan Liu, Taijiang Peng and Lianyu Fu. Phase structure development as preheating UHMWPE powder temperature changes in the micro-UPM process [J]. Journal of Micromechanics and Microengineering, 2016, DOI:10.1088/0960-1317/26/1/015014. (通讯作者)
[15] 徐斌，伍晓宇，凌世全，吴世云，罗烽，杜晨林，孙秀泉.飞秒激光切割与微细电阻滑焊组合制备三维金属微结构[J].光学精密工程, 2012,20(8): 1811-1823.
[16] 徐斌，伍晓宇，罗烽，杜晨林，孙秀泉.0Cr18Ni9不锈钢箔的飞秒激光烧蚀[J].光学精密工程, 2012,20(1): 45-51.
[17] 徐斌，伍晓宇，雷建国，罗烽，龚峰，杜晨林，阮双琛，王振龙.逐层微细电阻滑焊工艺制备三维微结构[J].光学精密工程，2014, 22(5): 1251-1259.
[18] 徐斌，伍晓宇，凌世全，罗烽，杜晨林，孙秀泉.多脉冲飞秒激光烧蚀金属箔的热电子发射数值模拟[J].激光与光电子学进展, 2012,49: 1-7.

代表会议论文：

[1] Bin Xu, Xiaoyu Wu, Luo Feng, Chenlin Du, Sun Xiu-quan. Research on the forming mechanism of micro-moulds based on laminated slip-welding of ultrathin stainless steel foils [C]. 2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011.
[2] Bin Xu, Xiao-yu Wu, Shi-quan Ling, Kai Yi, Feng Luo, Chenlin Du, Xiu-quan Sun. Research on the micro-cutting of 0Cr18Ni9 stainless steel films by femtosecond laser [C]. 2011 International Conference on Applied Mechanics, Materials and Manufacturing, ICAMMM 2011.

代表专利：

(1) 徐斌; 伍晓宇; 雷建国; 罗烽; 梁雄; 阮双琛,一种基于薄片电极的微细电火花制备三维微结构的加工方法, 2013.9.25, 中国, ZL201310442881.8.
(2) 徐斌; 伍晓宇; 梁雄; 雷建国; 阮双琛,一种基于双向三维特征叠加的三维微结构加工方法, 2016.1.28, 中国, ZL201610070770.2.
(3) 徐斌; 伍晓宇; 雷建国; 梁雄; 赵航; 程蓉; 郭登极; 阮双琛,新型的薄片队列微电极, 2017.5.16, 中国, ZL201720545468.8

代表著作：

获得荣誉：

中国光学工程学会, 创新技术一等奖,2016.5.1（排名第三）

主要学术兼职：

中国机械工程学会特种加工分会会员，SCI期刊《Chinese Optics Letters》、《Materials Research Innovations》，EI期刊《光学精密工程》审稿人。