教育背景：

(1) 2010.9–2013.7, 深圳大学, 光学工程, 工学博士；
(2) 2007.9–2010.7, 深圳大学, 机械电子工程, 工学硕士；
(3) 2003.9–2007.7, 中国人民解放军海军航空大学, 工学学士；

工作履历：

(1) 2026.01-至今，深圳大学, 机电与控制工程学院机械电子工程系, 教授；
(2) 2017.12-2025.12, 深圳大学, 机电与控制工程学院机械电子工程系, 副教授；
(3) 2017.1-2017.11, 深圳大学, 机电与控制工程学院机械电子工程系, 副研究员；
(4) 2015.7-2016.12, 深圳大学, 机电与控制工程学院机械电子工程系, 讲师；
(5) 2013.7-2015.6, 哈尔滨工业大学机械工程, 博士后；

主持项目：

[1]*********及性能测试，ZF类项目，252万，2023.12-2025.12，在研。
[2]*********及样机系统集成，GF*****计划项目，71.3万，2024.12-2025.12，在研。
[3]*********策略研究，GF*****项目，32.3万，2024.12-2025.8，在研。
[4]广东省微纳光机电工程技术重点实验室，省级平台建设项目，300万，2023.12-2025.12，在研。
[5]三维微电极叠层拟合制备及其成形磨削与质量控制，国家自然科学基金项目，25万元，2015.1-2017.12已结题。
[6]三维队列微电极叠层拟合制备及其微细电火花加工应用，广东省自然科学基金项目，10万元，2016.1-2017.12，结题。
[7]复合材料三维电极微模具关键技术研发，深圳市技术攻关项目，120万元，结题。
[8]微细电火花辅助加工印制电路板微孔结构关键技术研发，深圳市技术攻关项目，90万元，结题。
[9]薄片队列微电极微细电火花加工三维微模具及其表面台阶效应与电极损耗规律，深圳市基础研究项目，50万元，结题。

代表期刊论文 ：

[33] Liangjian Liu, Zhiqiang Xu, Zhenjie Lai, Bin Xu, Taofeng Wu, Guangying Ma, Hongdong Zhang, Jiahao Li, Weilei Ma, Tiancheng Lei, Xiufeng Li, Zeyi Guo, Zheng Song, Ningbo Chen, Shiwei Ye, Jing Meng, Puxiang Lai, Feng Shen, Junlei Chang, Yingjie Zhu, Hairong Zheng, Wei Zheng and Chengbo Liu. Photoacoustic and fluorescence hybrid microscope for cortex-wide imaging of neurovascular dynamics with subcellular resolution. Science Advances, 2025, 11(30): eadw5275. （共同一作，Science子刊）
[32] Bin Xu, Weitong Liu, Shutian Zhang, Likuan Zhu, Qingyong Zhou, Xiaoyu Wu. Fabrication of CuSn functionally gradient electrode and its application in EDM for processing micro-groove. Journal of Materials Research and Technology, 2025, 37: 3255-3268.
[31] Bin Xu, Weitong Liu, Manqun Lian, Jianguo Lei, Xiaoyu Wu, Lianyu Fu, Chunyang Zhao & Canbin Zhang. Fabrication of helical flutes on the micro-drill surface by micro-EDM using composite disc foil electrodes.  The International Journal of Advanced Manufacturing Technology, 2025, 138: 2357-2367.
[30] Bin Xu, Yangquan Liu, Jianguo Lei, Hang Zhao,  Cheng Guo, Xiaoyu Wu, Taijiang Peng. Selective laser melting of 3D queue microelectrodes and its  application in microEDM [J]. The International Journal of Advanced Manufacturing Technology, 2024, 134: 1433-1446.
[29] Bo Wu, Yongxin Cao, Bin Xu*, Zuohuan Hu, Yangqun Liu, Tao Cheng. Micro-milling of 3D micro-electrode and its application in 3D microEDM [J]. The International Journal of Advanced Manufacturing Technology, 2024, 132, 5597-5607.
[28] Chunyang Zhao, Zhihui Yang, Shuo Kang, Xiuhong Qiu and Bin Xu*. High-Speed Laser Cutting Silicon-Glass Double Layer Wafer with Laser-Induced Thermal-Crack Propagation [J]. Processes, 2023, 11: 1177.
[27] Hang Zhao, Chang Gao, Cheng Guo, Bin Xu*, Xiao-Yu Wu and Jian-Guo Lei. In-situ TiC-reinforced Ni-based composite coatings fabricated by ultrasonic-assisted electrospark powder deposition [J]. JOURNAL OF ASIAN CERAMIC SOCIETIES. 2023, 11: 26-33.
[26] Bin Xu, Meng-Yang Wei, Xiao-Yu Wu, Jian-Guo Lei, Zhi-Wen Zhou, Lian-Yu Fu and Li-Kuan Zhu. An Injecting Molding Method for Forming the HFRP/PA6 Composite Parts [J]. Polymers, 2022, 14, 5085.
[25] ManQun Lian, JianGuo Lei, XiaoYu Wu, Feng Luo, HeXi Luo, Bin Xu*. MicroEDM of 3D microstructure on microshaft based on the rotation of microshaft [J]. The International Journal of Advanced Manufacturing Technology, 2022, 121: 5537-5548.
[24] Bin Xu, Tao Feng, Xiaoyu Wu, Feng Luo, Jianguo Lei, Jun Yang & Shiyun Wu.  Micro-EDM of micro-stepped hole based on the wear of micro-bit, Materials and Manufacturing Processes, 2022, 37: 349-358.
[23] Bin Xu, Tao Feng, Yongchang Xiao, Xiaoyu Wu, Lianyu Fu, Hang Zhao, Jianguo Lei, Chunyang Zhao. MicroEDM of microstepped hole in YG8 cemented carbide by using micro milling cutter [J]. The International Journal of Advanced Manufacturing Technology, 2022, 121: 1015-1026.
[22] Bin Xu, Man-qun Lian, Sheng-gui Chen, Jian-guo Lei, Xiao-yu Wu, Cheng Guo, Tai-jiang Peng, Jun Yang, Feng Luo, Hang Zhao. Combining PMEDM with the tool electrode sloshing to reduce recast layer of titanium alloy generated from EDM [J]. The International Journal of Advanced Manufacturing Technology, 2021, 117 :1535-1545.
[21] Xinke Feng, Bin Xu*, Jianguo Lei, Xiaoyu Wu, Feng Luo and Lianyu Fu. Elimination of Hole Mouth Burr in Multilayer PCB Micro-Hole by Using Micro-EDM [J]. Micromachines 2021, 12: 688.
[20] Bin Xu, Meng-Yang Wei, Xiao-Yu Wu, Lian-Yu Fu, Feng Luo and Jian-Guo Lei. Fabrication of Micro-Groove on the Surface of CFRP to Enhance the Connection Strength of Composite Part [J]. Polymers 2021, 13: 4039.
[19] Bin Xu, Xin-ke Feng, Xiao-yu Wu, Feng Luo, Lian-yu Fu, Xue-tao Zhai,  Yong-hua Zhao, Hang Zhao, Jian-guo Lei. Micro-EDM-assisted machining micro-holes in printed circuit board [J]. The International Journal of Advanced Manufacturing Technology, 2021, 113: 1191-1201.
[18] Sheng-gui Chen, Man-qun Lian, Xiao-yu Wu, Jian-guo Lei, Hang Zhao, Tai-jiang Peng, Feng Luo, Jun Yang, Bin Xu*. Study on the micro-EDM processing characteristics of Ti-6Al-4V alloy with different electrode materials [J]. The International Journal of Advanced Manufacturing Technology, 2021, 116: 3369-3376.
[17] Jianguo Lei, Xiaoyu Wu, Zhiwen Zhou, Bin Xu *, Likuan Zhu, Yong Tang. Sustainable mass production of blind multi-microgrooves by EDM with a long-laminated electrode [J]. Journal of Cleaner Production, 2021, 279: 123492.
[16] Bin Xu, Kang Guo, Likuan Zhu, Xiaoyu Wu and Jianguo Lei. Applying Foil Queue Microelectrode with Tapered Structure in Micro-EDM to Eliminate the Step Effect on the 3D Microstructure’s Surface [J]. Micromachines, 2020, 11: 335.
[15] Xiong Liang, Yongjing Liu, Jiang Ma, Feng Gong, Yan Lou, Lianyu Fu and Bin Xu*. Fabrication of Micro Ultrasonic Powder Molding Polypropylene Part with Hydrophobic Patterned Surface [J]. Materials 2020, 13: 3247.
[14] Xiong Liang, Yong-jing Liu, Sheng-gui Chen, Jiang Ma, Xiao-yu Wu, Hong-yan Shi , Lian-yu Fu, Bin Xu*. Fabrication of microplastic parts with a hydrophobic surface by micro ultrasonic powder moulding [J]. Journal of Manufacturing Processes, 2020, 56: 180-188.
[13] Bin Xu, Sheng-gui Chen, Xiong Liang, Jian-guo Lei, Hong-yan Shi, Lian-yu Fu, Jun Yang, Tai-jiang Peng, Hang Zhao,  Li-kuan Zhu. Recast layer removal of 304 stainless steel by combining micro-EDM with negative polarity micro-EDM [J]. The International Journal of Advanced Manufacturing Technology, 2020, 107: 4713-4723.
[12] Jianguo Lei, Kai Jiang, Xiaoyu Wu, Hang Zhao and Bin Xu*. Surface Quality Improvement of 3D Microstructures Fabricated by Micro-EDM with a Composite 3D Microelectrode [J]. Micromachines 2020, 11: 868.
[11] Hang Zhao, Yu-feng Liu, Xiao-yu Wu, Chang Gao, Li-kuan Zhu, Bin Xu*. The effect of structural parameters on the tribological properties of structural-coupling self-lubricating coatings [J]. Surface & Coatings Technology, 2020, 403: 126358.
[10] Bin Xu, Sheng-gui Chen, Jian-guo Lei, Hang Zhao, Xiao-yu Wu, Xiong Liang, Hong-yan Shi, Lian-yu Fu. The International Journal of Advanced Manufacturing Technology, 2020, 107: 645-651.
[9] Bin Xu, Kang Guo, Li-kuan Zhu, Xiao-yu Wu, Jian-guo Lei, Hang Zhao, Yong Tang, Xiong Liang. The wear of foil queue microelectrode in 3D micro-EDM [J]. The International Journal of Advanced Manufacturing Technology, 2019, 104:3107-3117.
[8] Zhao-zhi Wu, Xiao-yu Wu, Bin Xu*, Deng-ji Guo, Yong Tang, Dong-feng Diao. Reverse-polarity PMEDM using self-welding bundled 3D-laminated microelectrodes [J]. Journal of Materials Processing Technology, 2019, 273: 116261.
[7] Bin Xu, Kang Guo, Xiao-yu Wu, Jian-guo Lei, Xiong Liang, Deng-ji Guo, Jiang Ma and Rong Cheng. Applying a foil queue micro-electrode in micro-EDM to fabricate a 3D micro-structure [J]. Journal of Micromechanics and Microengineering, 2018, 28: 055008.
[6] Bin Xu, Xiao-yu Wu, Jian-guo Lei, Hang Zhao, Xiong Liang, Rong Cheng, Deng-ji Guo. Elimination of 3D micro-electrode’s step effect and applying it in micro-EDM [J]. The International Journal of Advanced Manufacturing Technology, 2018, 96 : 429-438.
[5] Jianguo Lei, Xiaoyu Wu, Bo Wu, Bin Xu*,  Kai Jiang, Zhenlong Wang,  Shuangchen Ruan. Experimental research on eliminating the stair-stepping effect of laminated 3D microelectrodes by micro-ECM [J]. The International Journal of Advanced Manufacturing Technology, 2018, 98:937-946.
[4] Xu Bin，Wu Xiao-yu，Lei Jian-guo，Liang Xiong，Zhao Hang，Guo Deng-ji，Ruan Shuang-chen，Micro-ECM of 3D micro-electrode for efficiently processing 3Dmicro-structure[J]. International Journal of Advanced Manufacturing Technology，2016 :1-9.
[3] Bin Xu, Xiao-yu Wu, Jiang Ma, Xiong Liang, Jian-guo Lei, Bo Wu, Shuang-chen Ruan, Zhen-long Wang. Micro-EDM of 3D micro-mold from Pd40Cu30P20Ni10 metallic glass by using laminated 3D micro-electrode. [J]. Journal of Micromechanics and Microengineering, 2016, 26: 035004.
[2] Xiong Liang, Xiaoyu Wu, Bin Xu*, Jiang Ma, Zhiyuan Liu, Taijiang Peng and Lianyu Fu. Phase structure development as preheating UHMWPE powder temperature changes in the micro-UPM process [J]. Journal of Micromechanics and Microengineering, 2016, DOI:10.1088/0960-1317/26/1/015014.
[1] Bin Xu, Xiao-yu Wu, Jian-guo Lei, Rong Cheng, Shuang-chen Ruan, Zhen-long Wang. Laminated fabrication of 3D micro-electrode based on WEDM and thermal diffusion welding [J]. Journal of Materials Processing Technology, 2015, 221: 56-65.

代表会议论文：

[1] Bin Xu, Xiaoyu Wu, Luo Feng, Chenlin Du, Sun Xiu-quan. Research on the forming mechanism of micro-moulds based on laminated slip-welding of ultrathin stainless steel foils [C]. 2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011.
[2] Bin Xu, Xiao-yu Wu, Shi-quan Ling, Kai Yi, Feng Luo, Chenlin Du, Xiu-quan Sun. Research on the micro-cutting of 0Cr18Ni9 stainless steel films by femtosecond laser [C]. 2011 International Conference on Applied Mechanics, Materials and Manufacturing, ICAMMM 2011.

代表专利：

[1] 黎宇平，赖圳杰，徐斌，伍晓宇，石红雁. 一种应用于电火花加工复杂形状零件的电极设计方法及装置 [P]. 中国，发明专利，2026，ZL 2023 1 0485284.7.（第一发明人和第二发明人为本人指导的硕士研究生）
[2] 徐斌，黎宇平，伍晓宇，雷建国，赵航，朱立宽，胡作寰，高国利，付连宇. 一种固粉复合材料电极的制备方法及装置 [P]. 中国，发明专利，2025，ZL 2023 1 0793487.2.
[3] 丰新科，徐斌，常惠玉. 多电极放电加工辅助装置及电火花机床 [P]. 中国，发明专利，2025，ZL 2020 1 0977459.2. （第一发明人为指导的硕士研究生）
[4] 徐斌，刘伟桐，周庆勇，郑慧雯，赵航，雷建国，彭太江，朱立宽，郭程，付连宇. 一种针对P型单晶硅工件的电火花加工方法 [P]. 中国，发明专利，2024，ZL 2024 1 0755972.5.
[5] 徐斌，伍晓宇，雷建国，赵航，梁雄，龚峰，马将，汤勇，梁祖强. 一种三维微结构的加工方法 [P]. 中国，发明专利，2023，ZL 2018 1 1109883.4.
[6] 刘扬全，徐斌，连漫群，赖圳杰，伍晓宇，雷建国，赵航，付连宇，高国利. ：一种利用电火花加工技术加工复杂型腔的方法 [P]. 中国，发明专利，2023，ZL ZL 2022 1 0454951.0.（第一发明人为指导的硕士研究生）
[7] 徐斌，冯涛，雷建国，伍晓宇，付连宇，朱立宽，赵航. 基于电极损耗的微阶梯孔加工方法 [P]. 中国，发明专利，2022，ZL 202111138937.1.
[8] 徐斌，丰新科，伍晓宇，雷建国，赵航，石红雁，梁祖健，付连宇. 基于双加工工位的微型腔结构电加工方法及装置 [P].中国，发明专利，2021， ZL 201911201449.3.
[9] 徐斌，冯涛，伍晓宇，雷建国，赵航，石红雁，梁祖健，付连宇. 基于电火花加工的零件加工方法 [P]. 中国，发明专利，2020，ZL 201911035805.9
[10] 徐斌，丰新科，伍晓宇，雷建国，赵航，石红雁，梁祖健，付连宇. 电加工方法、装置、设备及存储介质 [P]. 中国，发明专利，2020，ZL 201911201450.6.
[11] 徐斌，伍晓宇，雷建国，梁雄，赵航，程蓉，郭登极，阮双琛. 新型的薄片队列微电极[P]. 中国，发明专利，2020，ZL 201710344079.3
[12] 徐斌，伍晓宇，梁雄，马将，雷建国，龚峰，程蓉，阮双琛. 加工微回转体结构的方法 [P]. 中国，发明专利，2019，ZL 201711125088.X.
[13] 徐斌，伍晓宇，雷建国，梁雄，赵航，程蓉，郭登极，阮双琛. 薄片队列微电极微细电火花加工方法及装置 [P]. 中国，发明专利，2019，ZL 201710345074.2.
[14] 徐斌，伍晓宇，梁雄，雷建国，阮双琛. 一种基于双向三维特征叠加的三维微结构加工方法 [P]. 中国，发明专利，2017，ZL 201610070770.2.
[15] 徐斌，伍晓宇，雷建国，罗烽，梁雄，阮双琛. 一种基于薄片电极的微细电火花制备三维微结构的加工方法 [P]. 中国，发明专利，2015，ZL 201310442881.8.

代表著作：

[1]Zhang Guo-qing, Xu Bin, Lu Yan-jun. Fabrication of Micro/Nano Structures via Precision Machining: Modelling, Processing and Evaluation [M]. Springer Nature, 2023, 978-981-99-1337-4.

获得荣誉：

[1] 阮双琛，伍晓宇，徐斌，雷建国，梁雄，杜晨琳. 飞秒激光与压力热扩散焊制备三维微电极关键工艺技术研究，2016，中国光学工程学会创新技术一等奖.
[2] 伍晓宇，徐斌，阮双琛，龚峰，罗峰，胡作寰，高国利，谢圣君，丘文桂，万珍平. 三维叠层微电极关键成形工艺技术及其产业化应用，2018，广东省科技进步奖二等奖.
[3] 石红雁，徐斌，梁雄，韩庆红，翟学涛，付连宇，张飞，朱建，郭强，赵航. 面向电子系统基础件微孔钻削的关键工艺技术与装备，2020，广东省科技进步奖二等奖.
[4] 胡作寰，高国利，徐斌，伍晓宇，袁林，张森，黄铁平，尹覃伟，吕伟，贾宇霖，谢万川，杨尧，黄曦松. 新型三维微细电火花电极制备与关键技术研究及产业化，2020，中国机械工业科技进步奖一等奖.
[5] 石红雁，徐斌，梁雄，韩庆红，翟学涛，付连宇，李宁，朱建. 面向电子系统基础件微孔钻削的关键工艺技术与装备，2020，深圳市科技进步奖二等奖.
[6] 深圳市优秀教师，2022年深圳市优秀教师，2022.09，独立获奖。
[7] 深圳大学优秀本科教学单项奖，优秀本科教师，2019.03，独立获奖。
[8] 深圳大学优秀共产党员，2021.07，独立获奖。
[9] 深圳大学教学单项奖，优秀本科教学组织管理奖，2020.06，第一完成人。
[10] 深圳大学“七一”表彰，优秀共产党员，2019.07，独立获奖。
[11] 深圳大学腾讯益友奖，优秀班主任，2018.12，独立获奖。
[12] 深圳大学第七届青年教师讲课竞赛一等奖，2016.09，独立获奖。
[13] 深圳大学优秀共产党员，2026.06，独立获奖。
[14] 2025年深圳大学科研工作突出贡献奖，2025.09，独立获奖。
[15] 深圳大学腾讯益友奖，优秀班主任，2018.12，独立获奖。
[16] 深圳大学优秀实习指导教师，2018.12，独立获奖。

主要学术兼职：

（1）中国机械工程学会特种加工分会理事；
（2）广东省机械工程学会特种加工分会理事；
（3）中文核心期刊《电加工与模具》青年编委；