教育背景：

美国佐治亚理工学院 电子与计算机工程博士

工作履历：

2025年03月至今 深圳大学, 机电及控制工程学院, 特聘教授；
2009年10月-2025年2月 台湾科技大学, 教授兼工程学院副院长

主持项目：

代表期刊论文 ：

1. Jinyang Li; Hung-Fei Kuo,”Feature Extraction From Diffraction Images Using a Spatial Light Modulator in Scatterometry, IEEE Transactions on Semiconductor Manufacturing, vol. 37, no. 4, pp. 518-526, 2024.
2. Jinyang Li; Hung-Fei Kuo, ”Dffraction-Based Overlay Metrology with Optical Convolution Layer,” IEEE Photonics Journal, vol. 15, no. 6, pp. 1-1 2023.
3. Chun-Han Su, Zi-Han Lin, Yu-Shin Lin, Hung-Fei Kuo,” Enhancement of Diffraction-Based Overlay Model for Overlay Target With Asymmetric Sidewall,” IEEE Transactions on Semiconductor Manufacturing, vol. 33, no. 3, August 2020.
4. Hung-Fei Kuo∗ , Guan-Hsuan Kao, Liang-Xiu Zhu , Kuo-Shu Hung , Yu-Hsin Lin, “Printing line/space patterns on nonplanar substrates using a digital micromirror device-based point-array scanning technique,” Optics and Lasers in Engineering, vol. 101, pp. 106-112, 2018.
5. Hung-Fei Kuo* and Frederick, ”Ant Colony Optimization-Based Freeform Sources for Enhancing Nanolithographic Imaging Performance,” IEEE Transactions on Nanotechnology, vol. 15, no. 4, July 2016.
6. Hung-Fei Kuo* and Yi-Jun Huang, “Resolution enhancement using pulse width modulation in digital micromirror device-based point-array scanning pattern exposure,” Optics and Lasers in Engineering vol. 79, 2016.
7. Hung-Fei Kuo* and Wei-Chen Wu, “Forming Freeform Source Shapes by Utilizing Particle Swarm Optimization to Enhance Resolution in Extreme UV Nanolithography,” IEEE Transactions on Nanotechnology, vol. 14, no. 2, March 2015.
8. Hung-Fei Kuo, “Effect of Source Pupil Shape on Process Windows in EUV Lithography,” IEEE Transactions on Nanotechnology, vol. 13, pp. 136-142, Mar. 2013
9. Hung-Fei Kuo and Frederick, ”Gaussian Beam Incident on One-Dimensional Diffraction Gratings with High-K Metal Gate Stacks,” J. Nanoscience and Nanotechnology, vol. 13, pp.1-6, 2013.
10.    Hung-Fei Kuo and Frederick, “Full Field Analysis of Critical Dimension Uniformity Due to Focal Variation for Contact Features in EUV Lithography,” J. Nanoscience and Nanotechnology, vol.13, pp.1-4, 2013.

代表会议论文：

代表专利：

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