欢迎访问深圳大学机电与控制工程学院官方网站!
伍晓宇      教授

性别:

邮箱: wuxy@szu.edu.cn

办公室: 机电楼S605

人才称号:

最终学位: 工学博士

办公电话: 0755-22673853

导师资格: 硕士研究生导师

研究领域:

微细加工技术

主讲本科课程:

成型工艺与模具CAD/CAM

主讲研究生课程:

微细加工理论

教育背景:

1992/09-1995/07,华中科技大学,机械学院,博士,导师:肖景容,肖祥芷;
1986/09-1989/07,江西工学院,机械系,硕士,导师:包忠诩,林治平;
1979/09-1983/07,江西工学院,机械系,学士。

工作履历:

2003/12-至今,深圳大学,机电与控制工程学院,教授;
1996/12–2003/11,深圳大学,机电与控制工程学院,副教授;
1996/08–1996/11,深圳大学,机电与控制工程学院,讲师;
1995/08-1996/07,深圳万国软件有限公司,技术部,工程师;
1989/08-1992/08,江西工学院,机械系,讲师;
1985/03-1986/08,成都整流器厂,工艺科,助理工程师;
1983/08-1985/02,江西制氧机厂,铸锻车间,技术员。

主持项目:

1)三维叠层微电极振动辅助电解加工及其台阶效应与质量控制,国家自然科学基金面上项目(51575360),75.6万元,执行期:2016.01-2019.12,在研。
2)微型腔叠层滑焊成形方法及其沉积效应机理研究,国家自然科学基金面上项目(51175348),60万元,执行期:2012.01-2015.12,已结题。

代表期刊论文:

[1] Zhaozhi Wu, Xiaoyu Wu*, Jianguo Lei*, Bin Xu, Kai Jiang, Jinming Zhong, Dongfeng Diao, Shuangchen Ruan. Vibration-assisted micro-ECM combined with polishing to machine 3D microcavities by using an electrolyte with suspended B4C particles [J]. Journal of Materials Processing Technology, 2018, 255:275-284.
[2] Bo Wu, Xiaoyu Wu*, Jianguo Lei*, Bin Xu, Shuangchen Ruan, Jinming Zhong. Study on machining 3D micro mould cavities using reciprocating micro ECM with queued foil microelectrodes [J]. Journal of Materials Processing Technology, 2017, 241:120-128.
[3] Wenyan Luo, Xiaoyu Wu*, Jianguo Lei*, Bin Xu, Rong Cheng, Shuangchen Ruan. Micro resistance weld moulding to fabricate CuSn33 alloy parts [J]. Journal of Materials Processing Technology, 2016, 231:137-142.
[4] Jianguo Lei, Xiaoyu Wu*, Bin Xu*, Zhentao Zhao, Shuangchen Ruan, Rong Cheng. Laminated fitting fabrication of Cu-Sn composite 3D microelectrodes and elimination of ridges on the machined surface of 3D micro-cavities [J]. Journal of Materials Processing Technology, 2015, 225:24-31.
[5] Wenyan Luo, Xiaoyu Wu*, Shiyun Wu, Bin Xu, Rong Cheng, Shuangchen Ruan. Micro-ultrasonic powder molding of Sn-Bi/Cu composite micro parts in semisolid form [J]. Journal of Materials Processing Technology, 2015, 223:313-318.
[6] Bin Xu, Xiaoyu Wu*, Jianguo Lei, Rong Cheng, Shuangchen Ruan, Zhenlong Wang. Laminated fabrication of 3D micro-electrode based on WEDM and thermal diffusion welding [J]. Journal of Materials Processing Technology, 2015,221:56-65.
[7] Shiyun Wu, Xiaoyu Wu*, Bin Xu, Rong Cheng, Feng Luo, Shuangchen Ruan. A micro-ultrasonic powder moulding method to fabricate Sn-Bi alloy micro parts [J]. Journal of Materials Processing Technology, 2014, 214: 2668-2675.
[8] Bin Xu, Xiaoyu Wu*, Jianguo Lei, Feng Luo, Feng Gong, Chenlin Du, Xiuquan Sun, Shuangchen Ruan. Research on micro-electric resistance slip welding of copper electrode during the fabrication of 3D metal micro-mold [J]. Journal of Materials Processing Technology, 2013,213:2174-2183.
[9] Xiong Liang, Jiang Ma*, Xiaoyu Wu*, Bin Xu, Feng Gong, Jianguo Lei, Taijiang Peng, Rong Cheng. Micro injection of metallic glasses parts under ultrasonic vibration [J]. Journal of Materials Science & Technology, 2017,33:703-707.
[10] Bin Xu, Kang Guo, Xiao-yu Wu*, Jianguo Lei*, Xiong Liang, Dengji Guo , Jiang Ma, Rong Cheng. Applying foil queue micro-electrode in micro-EDM to fabricate 3D micro-structure [J]. Journal of Micromechanics and Microengineering, 2018, DOI:10.1088/1361-6439/aaafae.
[11] Bin Xu, Xiaoyu Wu*, Jiang Ma, Xiong Liang, Jian-guo Lei*, Bo Wu, Shuangchen Ruan, Zhenlong Wang. Micro-Electrical discharge machining of 3D micro-mold from Pd40Cu30P20Ni10 metallic glass by using laminated 3D micro-electrode [J]. Journal of Micromechanics and Microengineering, 2016,26: 035004(10pp).
[12] Xiong Liang, Xiaoyu Wu*, Bin Xu*, Jiang Ma, Zhiyuan Liu, Taijiang Peng, Lianyu Fu. Phase structure development as preheating UHMWPE powder temperature changes in the micro-UPM process [J]. Journal of Micromechanics and Microengineering, 2016,26:015014(9pp).
[13] Xiong Liang, Xiaoyu Wu*, Kun Zeng, Bin Xu, Shiyun Wu, Hang Zhao, Bing Li, Shuangchen Ruan. Micro ultrasonic powder molding for semi-crystalline polymers [J]. Journal of Micromechanics and Microengineering, 2014,24:045014(10pp).

代表会议论文:

[1] Jianguo Lei, Xiaoyu Wu*, Bo Wu, Bin Xu, Dengji Guo, Jinming Zhong. Fabrication of 3D microelectrodes by combining wire electrochemical micromachining and micro-electric resistance slip welding [C]. Procedia CIRP, 2016,42:825-830.
[2] Dengji Guo, Xiaoyu Wu*, Jianguo Lei, Bin Xu, Reo Kometani, Feng Luo. Fabrication of micro/nanoelectrode using focused-ion-beam chemical vapor deposition, and its application to micro-ECDM [C]. Procedia CIRP, 2016, 42:733-736.

代表专利:

[1] 伍晓宇,陆建勋, 伍朝志, 罗烽, 阮双琛. 超声波辅助等径角挤压工艺及其装置, 2017.11,中国, ZL 2015 1 0848019.6
[2] 伍晓宇, 阮双琛, 程蓉, 梁雄, 郭小勤, 彭太江. 一种金属叠层实体制造快速成形方法, 2011.1, 中国, ZL 2009 1 0105056.2
[3] 伍晓宇, 徐平, 程蓉, 梁雄, 罗烽, 彭太江. 一种金属微零件成形模具及其成形方法, 2012.8, 中国, ZL 2010 1 0553958.5
[4] 伍晓宇, 罗峰, 钟金明, 彭太江, 梁雄, 程蓉. 一种微型钣金零件拉深成形方法, 2013.10, 中国,ZL 2012 1 0059399.1
[5] 伍晓宇, 黄桂坚, 柴金龙, 梁雄, 杨海彬. 一种通用注塑模架, 2009.11, 中国, ZL 2007 1 0077046.30
[6] 伍晓宇, 费跃农, 梁雄, 李伟荣, 丁磊. 一种选择性阻焊熔化粉末快速成形方法, 2009.11, 中国, ZL 2007 1 0124246.8
[7] 伍晓宇, 梁雄, 李积彬. 一种加固型快速粉末治金模具制造方法, 2009.7, 中国, ZL 2007 1 0075882.8

代表著作:

伍晓宇, 王志勇. 模具网络协同制造, 北京:机械工业出版社, 2008.3, ISBN 978-7-111-23450-0.

获得荣誉:

飞秒激光与压力热扩散焊制备三维微电极关键工艺技术研究, 中国光学工程学会创新技术奖一等奖,2016年5月。

主要学术兼职:

中国机械工程学会高级会员
中国机械工程学会、特种加工分会理事